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GCP Chip will be used to match new images in geometric correction.
Recognitioin of chip pattern requires feature extraction from nach rrame
of chip image adn needs to match the feature data through all frames.
IC chip layout pattern recognition algorithms using image processing techniques are being
developed for the automation of manufacturing and inspecting chips.
R. Kronberger, A. Geissler, and B. Friedmann, "New methods to determine the impedance of UHF RFID chips", IEEE international Conference, pp.
IEEE 17th International Symposium on High Performance Computer Architecture (HPCA), San Antonio, USA, Feb.

Conclusions: RFMP and DNA chip technologies were shown to be reliable methods for HPV genotyping with a high concordance.

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip
chip assemblies were investigated for the flip chip interconnections
on organic substrates with 100 um pitch. T. Braun, K.
F. Becker, M. Koch, V. Bader, R. Aschenbrenner and H.
Reichl, "High-temperature Reliability of Flip Chip Assemblies", Microelectron.